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| IJARIIE
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ. "DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS" International Journal Of Advance Research And Innovative Ideas In Education
Volume 5 Issue 2 2019 Page 2845-2850 |
| MLA
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ. "DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS." International Journal Of Advance Research And Innovative Ideas In Education
5.2(2019) : 2845-2850.
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| APA
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, & HARSHA RAJ. (2019). DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS. International Journal Of Advance Research And Innovative Ideas In Education,
5(2), 2845-2850.
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| Chicago
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ. "DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS." International Journal Of Advance Research And Innovative Ideas In Education
5, no. 2 (2019) : 2845-2850.
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| Oxford
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ. 'DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS',
International Journal Of Advance Research And Innovative Ideas In Education,
vol. 5, no. 2, 2019,
p. 2845-2850.
Available from IJARIIE, https://ijariie.com/AdminUploadPdf/DETERMINATION_OF_OPTIMUM_SUBSTRATE_THICKNESS_TO_CONTROL_THE_DISSOLUTION_AND_INTERFACIAL_REACTION_BETWEEN_SOLDER_SUBSTRATE_INTERFACIAL_REGIONS_FOR_ELECTRONIC_APPLICATIONS_ijariie10114.pdf (Accessed : ).
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| Harvard
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ. (2019) 'DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS',
International Journal Of Advance Research And Innovative Ideas In Education,
5(2), pp. 2845-2850IJARIIE [Online].
Available at: https://ijariie.com/AdminUploadPdf/DETERMINATION_OF_OPTIMUM_SUBSTRATE_THICKNESS_TO_CONTROL_THE_DISSOLUTION_AND_INTERFACIAL_REACTION_BETWEEN_SOLDER_SUBSTRATE_INTERFACIAL_REGIONS_FOR_ELECTRONIC_APPLICATIONS_ijariie10114.pdf (Accessed : )
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| IEEE
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ, "DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS,"
International Journal Of Advance Research And Innovative Ideas In Education,
vol. 5, no. 2, pp. 2845-2850,
Mar-App 2019. [Online].
Available: https://ijariie.com/AdminUploadPdf/DETERMINATION_OF_OPTIMUM_SUBSTRATE_THICKNESS_TO_CONTROL_THE_DISSOLUTION_AND_INTERFACIAL_REACTION_BETWEEN_SOLDER_SUBSTRATE_INTERFACIAL_REGIONS_FOR_ELECTRONIC_APPLICATIONS_ijariie10114.pdf [Accessed : ].
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| Turabian
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ. "DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS."
International Journal Of Advance Research And Innovative Ideas In Education [Online].
volume 5 number 2
().
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| Vancouver
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AKASH, BHARATHESH HEGDE, DIVAKAR K M, and HARSHA RAJ. DETERMINATION OF OPTIMUM SUBSTRATE THICKNESS TO CONTROL THE DISSOLUTION AND INTERFACIAL REACTION BETWEEN SOLDER/SUBSTRATE INTERFACIAL REGIONS FOR ELECTRONIC APPLICATIONS.
International Journal Of Advance Research And Innovative Ideas In Education [Internet]. 2019
[Cited : ];
5(2) : 2845-2850.
Available from: https://ijariie.com/AdminUploadPdf/DETERMINATION_OF_OPTIMUM_SUBSTRATE_THICKNESS_TO_CONTROL_THE_DISSOLUTION_AND_INTERFACIAL_REACTION_BETWEEN_SOLDER_SUBSTRATE_INTERFACIAL_REGIONS_FOR_ELECTRONIC_APPLICATIONS_ijariie10114.pdf
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