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Call for Papers:Vol.11 Issue.3

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Title: :  Assessment of Thermal Resistance on Brass Material of Electronic Packages
PaperId: :  10179
Published in:   International Journal Of Advance Research And Innovative Ideas In Education
Publisher:   IJARIIE
e-ISSN:   2395-4396
Volume/Issue:    Volume 5 Issue 2 2019
DUI:    16.0415/IJARIIE-10179
Licence: :   IJARIIE is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

Author NameAuthor Institute
Roshan Manoj AKAlvas Institute of Engineering and Technology
Abhilash CAlvas Institute of Engineering and Technology
Prasanna H SAlvas Institute of Engineering and Technology
Prathik PAlvas Institute of Engineering and Technology

Abstract

Mechanical Engineering
TIM, Thermal resistances, heat transfer, Thermocouples, surface topography
Thermal Interface Materials (TIMs) play a key role in the thermal management of microelectronics devices by providing a path of low thermal impedance between heat generating devices. TIMs provide mechanical coupling between the silicon device and the heat spreader sink. During device operation, the adhesive joint between the heat generating device and heat spreader sink is subjected to thermos mechanical stresses due to differences in thermal expansion coefficients of the silicone device and the heat spreader material. The adhesive joint can consequently de laminate the mating surfaces causing a significant increase in thermal impedance across the thermal interface material. TIMs offers improved thermal performance as well as enhanced reliability. In this present work experimentation carried out for different thickness of Brass plates with different loading conditions to determine the thermal resistance.

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IJARIIE Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P. "Assessment of Thermal Resistance on Brass Material of Electronic Packages" International Journal Of Advance Research And Innovative Ideas In Education Volume 5 Issue 2 2019 Page 3202-3205
MLA Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P. "Assessment of Thermal Resistance on Brass Material of Electronic Packages." International Journal Of Advance Research And Innovative Ideas In Education 5.2(2019) : 3202-3205.
APA Roshan Manoj AK, Abhilash C, Prasanna H S, & Prathik P. (2019). Assessment of Thermal Resistance on Brass Material of Electronic Packages. International Journal Of Advance Research And Innovative Ideas In Education, 5(2), 3202-3205.
Chicago Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P. "Assessment of Thermal Resistance on Brass Material of Electronic Packages." International Journal Of Advance Research And Innovative Ideas In Education 5, no. 2 (2019) : 3202-3205.
Oxford Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P. 'Assessment of Thermal Resistance on Brass Material of Electronic Packages', International Journal Of Advance Research And Innovative Ideas In Education, vol. 5, no. 2, 2019, p. 3202-3205. Available from IJARIIE, https://ijariie.com/AdminUploadPdf/Assessment_of_Thermal_Resistance_on__Brass_Material_of_Electronic_Packages_ijariie10179.pdf (Accessed : 11 October 2020).
Harvard Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P. (2019) 'Assessment of Thermal Resistance on Brass Material of Electronic Packages', International Journal Of Advance Research And Innovative Ideas In Education, 5(2), pp. 3202-3205IJARIIE [Online]. Available at: https://ijariie.com/AdminUploadPdf/Assessment_of_Thermal_Resistance_on__Brass_Material_of_Electronic_Packages_ijariie10179.pdf (Accessed : 11 October 2020)
IEEE Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P, "Assessment of Thermal Resistance on Brass Material of Electronic Packages," International Journal Of Advance Research And Innovative Ideas In Education, vol. 5, no. 2, pp. 3202-3205, Mar-App 2019. [Online]. Available: https://ijariie.com/AdminUploadPdf/Assessment_of_Thermal_Resistance_on__Brass_Material_of_Electronic_Packages_ijariie10179.pdf [Accessed : 11 October 2020].
Turabian Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P. "Assessment of Thermal Resistance on Brass Material of Electronic Packages." International Journal Of Advance Research And Innovative Ideas In Education [Online]. volume 5 number 2 (11 October 2020).
Vancouver Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P. Assessment of Thermal Resistance on Brass Material of Electronic Packages. International Journal Of Advance Research And Innovative Ideas In Education [Internet]. 2019 [Cited : 11 October 2020]; 5(2) : 3202-3205. Available from: https://ijariie.com/AdminUploadPdf/Assessment_of_Thermal_Resistance_on__Brass_Material_of_Electronic_Packages_ijariie10179.pdf
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