Call for Papers:Vol.11 Issue.4

Submission
Last date		 28-Aug-2025
Acceptance Status In One Day
Paper Publish In Two Days
Submit ManuScript

News & Updates

Submit Article

Dear Authors, Article publish in our journal for Volume-11,Issue-4. For article submission on below link: Submit Manuscript


Join As Board

Dear Reviewer, You can join our Reviewer team without given any charges in our journal. Submit Details on below link: Join As Board


Paper Publication Charges

IJARIIE APP
Download Android App

For Authors

Archives

IJARIIE Board

Downloads

Android App

Download IJARIIE APP

Authors

Title: :  DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD
PaperId: :  3641
Published in:   International Journal Of Advance Research And Innovative Ideas In Education
Publisher:   IJARIIE
e-ISSN:   2395-4396
Volume/Issue:    Volume 3 Issue 1 2017
DUI:    16.0415/IJARIIE-3641
Licence: :   IJARIIE is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

Author NameAuthor Institute
PANKAJ JIVAN PATELP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada
KAILAS TUKARAM PATILP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada
MANKALAL HIRAJI PATILP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada

Abstract

Mechanical Engineering
liquid cooling, heat dissipation rate, electronic chips, CFD simulation
The current trend of miniaturization and higher performance of electronic devices demands cost-effective cooling solutions capable to dissipate increasingly larger heat fluxes. Several technological challenges exist in the fields of materials, manufacturing, packaging and thermal management of high-power electronics. Conventional cooling technologies, such as natural and forced convection of air in heat sinks, are limited to meet the cooling requirements of new generation high-power electronics boards used for high end applications. Liquid-cooling is a promising thermal management method, where larger heat transfer coefficients may be achieved due to the intrinsic thermo physical properties of liquid coolants in combination with larger heat transfer areas achieved through small flow passages. In this work a liquid cooling channel is designed for the high dissipation microprocessor board which is not cooled by conventional fan/air cooling. The liquid channel is designed and optimized using CFD for different parameters like mass flow rate and channel sizes.

Citations

Copy and paste a formatted citation or use one of the links to import into a bibliography manager and reference.

IJARIIE PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD" International Journal Of Advance Research And Innovative Ideas In Education Volume 3 Issue 1 2017 Page 163-173
MLA PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education 3.1(2017) : 163-173.
APA PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, & MANKALAL HIRAJI PATIL. (2017). DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD. International Journal Of Advance Research And Innovative Ideas In Education, 3(1), 163-173.
Chicago PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education 3, no. 1 (2017) : 163-173.
Oxford PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD', International Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 1, 2017, p. 163-173. Available from IJARIIE, http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 12 December 2023).
Harvard PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. (2017) 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD', International Journal Of Advance Research And Innovative Ideas In Education, 3(1), pp. 163-173IJARIIE [Online]. Available at: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 12 December 2023)
IEEE PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL, "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD," International Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 1, pp. 163-173, Jan-Feb 2017. [Online]. Available: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf [Accessed : 12 December 2023].
Turabian PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education [Online]. volume 3 number 1 (12 December 2023).
Vancouver PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD. International Journal Of Advance Research And Innovative Ideas In Education [Internet]. 2017 [Cited : 12 December 2023]; 3(1) : 163-173. Available from: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf
BibTex EndNote RefMan RefWorks

Number Of Downloads


Last download on 12/12/2023 12:38:03 PM

Save in Google Drive

Similar-Paper

TitleArea of ResearchAuther NameAction
PARAMETRIC INVESTIGATION STUDIES OF WELDS MADE BY HYBRID FRICTION WELDING PROCESS FOR HARD STEEL ALLOYSMECHANICAL ENGINEERINGDARSHAN R. MISKIN Download
Evaluation of wear properties of Al 7075 alloy reinforced with herbal extracted SiCMechanical EngineeringSrinivasa rao G Download
FRICTION SURFACING OF AA5083 ON AA7075: INFLUENCE OF PROCESS PARAMETERS ON MECHANICAL PROPERTIESsajjar99@gmail.comYANAMALA NAVEEN KUMAR Download
Performance Analysis Of Ceramic Composite For Bearing ApplicationMechanical EngineeringMr. P. J. Waditke Download
Urban Heat Island Mitigation Using Advanced Reflective Pavement CoatingsM.Tech.Radha Download
Design And Development of Battery Thermal Management System for Electric Vehicle ApplicationMechanical EngineeringSagar Bhandare Download
Analysis of Thermal Enhancement on Spiral Radiator with Different Fin ShapeMechanical EngineeringPintu Kumar Download
Performance and emission analysis of waste cooking oils blended with diethyl ether for variable compression ratioMechanical Chetan B.Satkar Download
Design, Fabrication and Experimental Analysis on Horizontal Axis Rose Profile Wind Turbine.MechanicalDr.P.D.Kabudke Download
A Comprehensive Review of Hydrogen Fuel Cell Technology: Developments, Applications, and Future ProspectsMECHANICAL ENGINEERINGMr. AMOL DILIPRAO PATIL Download
To design and develop pedal operated turnstile power generation systemMechanical EngineeringNagare Abhijit Ramkrushna Download
Development of a biomass digester for domestic useRenewable energy systemsObadiegwu Bright Nnebuike Download
Investigation of Metal inert Gas welding process through different parameter for Chromium Nickel Stainless Steel and Hot Rolled Medium and High Tensile Structural SteelEngineeringMr. Vikrant Khandare Download
Review on Design and development of air cooler with integrated air conditioningMechanical Engineering Rahul Bhosale Download
REVIEW ON CIRCULAR PIN FINS IN FORCED CONVECTIONMechanical EngineeringSalunke Sopan Download
12