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| IJARIIE
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD" International Journal Of Advance Research And Innovative Ideas In Education
Volume 3 Issue 1 2017 Page 163-173 |
| MLA
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education
3.1(2017) : 163-173.
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| APA
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, & MANKALAL HIRAJI PATIL. (2017). DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD. International Journal Of Advance Research And Innovative Ideas In Education,
3(1), 163-173.
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| Chicago
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education
3, no. 1 (2017) : 163-173.
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| Oxford
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD',
International Journal Of Advance Research And Innovative Ideas In Education,
vol. 3, no. 1, 2017,
p. 163-173.
Available from IJARIIE, http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 12 December 2023).
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| Harvard
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. (2017) 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD',
International Journal Of Advance Research And Innovative Ideas In Education,
3(1), pp. 163-173IJARIIE [Online].
Available at: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 12 December 2023)
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| IEEE
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL, "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD,"
International Journal Of Advance Research And Innovative Ideas In Education,
vol. 3, no. 1, pp. 163-173,
Jan-Feb 2017. [Online].
Available: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf [Accessed : 12 December 2023].
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| Turabian
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD."
International Journal Of Advance Research And Innovative Ideas In Education [Online].
volume 3 number 1
(12 December 2023).
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| Vancouver
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PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD.
International Journal Of Advance Research And Innovative Ideas In Education [Internet]. 2017
[Cited : 12 December 2023];
3(1) : 163-173.
Available from: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf
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