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Title: :  DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD
PaperId: :  3641
Published in:   International Journal Of Advance Research And Innovative Ideas In Education
Publisher:   IJARIIE
e-ISSN:   2395-4396
Volume/Issue:    Volume 3 Issue 1 2017
DUI:    16.0415/IJARIIE-3641
Licence: :   IJARIIE is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

Author NameAuthor Institute
PANKAJ JIVAN PATELP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada
KAILAS TUKARAM PATILP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada
MANKALAL HIRAJI PATILP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada

Abstract

Mechanical Engineering
liquid cooling, heat dissipation rate, electronic chips, CFD simulation
The current trend of miniaturization and higher performance of electronic devices demands cost-effective cooling solutions capable to dissipate increasingly larger heat fluxes. Several technological challenges exist in the fields of materials, manufacturing, packaging and thermal management of high-power electronics. Conventional cooling technologies, such as natural and forced convection of air in heat sinks, are limited to meet the cooling requirements of new generation high-power electronics boards used for high end applications. Liquid-cooling is a promising thermal management method, where larger heat transfer coefficients may be achieved due to the intrinsic thermo physical properties of liquid coolants in combination with larger heat transfer areas achieved through small flow passages. In this work a liquid cooling channel is designed for the high dissipation microprocessor board which is not cooled by conventional fan/air cooling. The liquid channel is designed and optimized using CFD for different parameters like mass flow rate and channel sizes.

Citations

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IJARIIE PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD" International Journal Of Advance Research And Innovative Ideas In Education Volume 3 Issue 1 2017 Page 163-173
MLA PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education 3.1(2017) : 163-173.
APA PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, & MANKALAL HIRAJI PATIL. (2017). DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD. International Journal Of Advance Research And Innovative Ideas In Education, 3(1), 163-173.
Chicago PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education 3, no. 1 (2017) : 163-173.
Oxford PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD', International Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 1, 2017, p. 163-173. Available from IJARIIE, http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 14 January 2022).
Harvard PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. (2017) 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD', International Journal Of Advance Research And Innovative Ideas In Education, 3(1), pp. 163-173IJARIIE [Online]. Available at: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 14 January 2022)
IEEE PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL, "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD," International Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 1, pp. 163-173, Jan-Feb 2017. [Online]. Available: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf [Accessed : 14 January 2022].
Turabian PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." International Journal Of Advance Research And Innovative Ideas In Education [Online]. volume 3 number 1 (14 January 2022).
Vancouver PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD. International Journal Of Advance Research And Innovative Ideas In Education [Internet]. 2017 [Cited : 14 January 2022]; 3(1) : 163-173. Available from: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf
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