Call for Papers:Vol.3 Issue.4

Submission
Last date		 30-08-2017
Acceptance Status In One Day
Paper Publish In Two Days
Submit ManuScript

News & Updates

Submit Article

Dear Authors, Article publish in our journal for Volume-3,Issue-4. For article submission on below link: Submit Manuscript


Join As Board

Dear Reviewer, You can join our Reviewer team without given any charges in our journal. Submit Details on below link: Join As Board


Paper Publication Charges

IJARIIE APP
Download Android App

For Authors

Archives

IJARIIE Board

Downloads

Android App

Download IJARIIE APP

Authors

Title: :  DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD
PaperId: :  3641
Published in:   Internation Journal Of Advance Research And Innovative Ideas In Education
Publisher:   IJARIIE
e-ISSN:   2395-4396
Volume/Issue:    Volume 3 Issue 1 2017
DUI:    16.0415/IJARIIE-3641
Licence: :   IJARIIE is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

Auther NameAuther Institute
PANKAJ JIVAN PATELP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada
KAILAS TUKARAM PATILP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada
MANKALAL HIRAJI PATILP.S.G.V.P. Mandal’s D.N.Patel College Of Engineering Shahada

Abstract

Mechanical Engineering
liquid cooling, heat dissipation rate, electronic chips, CFD simulation
The current trend of miniaturization and higher performance of electronic devices demands cost-effective cooling solutions capable to dissipate increasingly larger heat fluxes. Several technological challenges exist in the fields of materials, manufacturing, packaging and thermal management of high-power electronics. Conventional cooling technologies, such as natural and forced convection of air in heat sinks, are limited to meet the cooling requirements of new generation high-power electronics boards used for high end applications. Liquid-cooling is a promising thermal management method, where larger heat transfer coefficients may be achieved due to the intrinsic thermo physical properties of liquid coolants in combination with larger heat transfer areas achieved through small flow passages. In this work a liquid cooling channel is designed for the high dissipation microprocessor board which is not cooled by conventional fan/air cooling. The liquid channel is designed and optimized using CFD for different parameters like mass flow rate and channel sizes.

Citations

Copy and paste a formatted citation or use one of the links to import into a bibliography manager and reference.

IJARIIE PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD" Internation Journal Of Advance Research And Innovative Ideas In Education Volume 3 Issue 1 2017 Page 163-173
MLA PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." Internation Journal Of Advance Research And Innovative Ideas In Education 3.1(2017) : 163-173.
APA PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, & MANKALAL HIRAJI PATIL. (2017). DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD. Internation Journal Of Advance Research And Innovative Ideas In Education, 3(1), 163-173.
Chicago PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." Internation Journal Of Advance Research And Innovative Ideas In Education 3, no. 1 (2017) : 163-173.
Oxford PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD', Internation Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 1, 2017, p. 163-173. Available from IJARIIE, http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 08 January 2017).
Harvard PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. (2017) 'DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD', Internation Journal Of Advance Research And Innovative Ideas In Education, 3(1), pp. 163-173IJARIIE [Online]. Available at: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf (Accessed : 08 January 2017)
IEEE PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL, "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD," Internation Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 1, pp. 163-173, Jan-Feb 2017. [Online]. Available: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf [Accessed : 08 January 2017].
Turabian PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. "DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD." Internation Journal Of Advance Research And Innovative Ideas In Education [Online]. volume 3 number 1 (08 January 2017).
Vancouver PANKAJ JIVAN PATEL, KAILAS TUKARAM PATIL, and MANKALAL HIRAJI PATIL. DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD. Internation Journal Of Advance Research And Innovative Ideas In Education [Internet]. 2017 [Cited : 08 January 2017]; 3(1) : 163-173. Available from: http://ijariie.com/AdminUploadPdf/DESIGN_OF_LIQUID_COOLING_PREMISES_USING_CFD_FOR_HIGH_HEAT_DISSIPATION_ELECTRONIC_BOARDS_ijariie3641.pdf
BibTex EndNote RefMan RefWorks

Number Of Downloads


Last download on 1/8/2017 3:31:36 AM

Save in Google Drive

Similar-Paper

TitleArea of ResearchAuther NameAction
“Experimental Analysis To Enhance The Heat Transfer By Using Dimpled (Cashew And Capsule) Surface”Heat Power Engineering (Mechanical Engineering)Avinash Rambhau Mankar Download
DESIGN AND MODIFICATION OF BICYCLE BY USING ADDITIONAL SPROCKETSMechanical Engineering Sanjeey Reddy K Hudgikar Download
EFFECT OF PROCESS PARAMETERS IN CNC DRILLING OF ALUMINIUM MATRIX COMPOSITE BY USING GRA AND ANOVAMECHANICAL ENGINEERINGK.H. Sanjeev Reddy Download
Fabrication of Aluminum alloy 2219 by using Stir Casting Process and Comparison of Micro structural and Mechanical Properties of Alloy 2219 with the Industrial based fabricated AlloyMechanical Engineering Sanjeev reddy K Hudjikar Download
Experimental investigation and FEA of wear in gear at torque loading conditionsMechanical Engineering (Design)MUNDE RAHUL M. Download
PERFORMANCE ANALYSIS OF TWO CYLINDER DIESEL ENGINE VIBRATIONS USING DIFFERENT ENGINE MOUNTINGSMECHANICAL ENGINEERINGPADAVALA SAI NAGENDRA Download
Rotor bearing system FEA analysis for misalignmentMechanical EngineeringSachin D. Dere Download
FUZZY NORMED AND BANACH SPACE IN FUZZYTOPOLOGICAL SPACESMATHEMATICSM.SANGEETHA Download
FINITE VOLUME METHOD ANALYSIS OF EROSIVE WEAR IN PEI COMPOSITEMECHANICAL ENGINEERINGAmit Shrivastava Download
Failure Analysis of Two Wheeler Crankshaft Using Finite Element AnalysisMechanical EngineeringTrupti Ashok Dhage Download
STRENGTH ANALYSIS OF TIG AND SMAW WLEDINGMechanical EngineeringMr.Monish Ilhe Download
Design and Development of Control Panel Box for Diesel Generator using Finite Element MethodMechanical EngineeringAmar R Kadam Download
“REVIEW & ANALYSIS OF CANTILEVER BEAM CRANE FOR WEIGHT REDUCTION BY USING TOPOGRAPHY METHOD”mechanical engineeringmiss.padwal Priyanka Suresh Download
WEAR & THERMAL ANALYSIS OF DISC BRAKE ROTOR FOR DIFFERENT MATERIALSMechanical EngineeringHarshal Suresh Shinde Download
CRACK DETERMINATION IN PROPELLER SHAFT USING NATURAL FREQUENCYMechanical EngineeringDineshsing R. Pardeshi Download
12