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Title: :  Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application
PaperId: :  5449
Published in:   International Journal Of Advance Research And Innovative Ideas In Education
Publisher:   IJARIIE
e-ISSN:   2395-4396
Volume/Issue:    Volume 3 Issue 3 2017
DUI:    16.0415/IJARIIE-5449
Licence: :   IJARIIE is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

Author NameAuthor Institute
Mahendra Sukhadeo WalunjkarShreeyash college of Engineering & Technology, Aurangabad-431005
Prof. Dipak A DeshmukhShreeyash college of Engineering & Technology, Aurangabad-431005

Abstract

Mechanical Engineering
Heat sink1, Thermal performance2, Electronics Cooling3, Heat transfer4
This paper reviews the previous work on thermal performance analysis of heat sink in order to determine the enhancement in the heat transfer rate. Many engineering systems during their operation generate heat. If this generated heat is not dissipated rapidly to its surrounding atmosphere, this may cause rise in temperature of the system components. This by-product cause serious overheating problems in system and leads to system failure, so the generated heat within the system must be rejected to its surrounding to maintain the system at recommended temperature for its efficient working. The techniques used in the cooling of high power density electronic devices vary widely, depending on the application and the required cooling capacity. The heat generated by the electronic components has to pass through a complex network of thermal resistances to the environment.The thermal resistance and pressure drop are considered as multiple thermal performance characteristics. The effects of geometric parameters, fin height, fin diameter, fin material, base to surrounding temperature difference on heat transfer performance of fin arrays& fin separation value has been determined. Heat transfer rate increases with the increase in approach velocity, pin diameter & number of pins. The effect of fin density on heat transfer performance is examined. Heat transfer rate also increases with the increase in thermal conductivity of the material & with the pin height. In-line arrangement gives higher heat sink resistance and lower pressure drop than the staggered arrangement. Heat transfer models for In-line & Staggered arrangements are suitable in designing pin fin heat sinks. The effects of Reynolds No & Nusselts No on the behaviour of channel are also studied.

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IJARIIE Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh. "Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application" International Journal Of Advance Research And Innovative Ideas In Education Volume 3 Issue 3 2017 Page 2413-2418
MLA Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh. "Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application." International Journal Of Advance Research And Innovative Ideas In Education 3.3(2017) : 2413-2418.
APA Mahendra Sukhadeo Walunjkar, & Prof. Dipak A Deshmukh. (2017). Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application. International Journal Of Advance Research And Innovative Ideas In Education, 3(3), 2413-2418.
Chicago Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh. "Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application." International Journal Of Advance Research And Innovative Ideas In Education 3, no. 3 (2017) : 2413-2418.
Oxford Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh. 'Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application', International Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 3, 2017, p. 2413-2418. Available from IJARIIE, http://ijariie.com/AdminUploadPdf/Review_on_Thermal_Performance_Analysis__Experimental_Study_of_Heat_Sink_used_for_Electronics_Application_ijariie5449.pdf (Accessed : 22 September 2022).
Harvard Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh. (2017) 'Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application', International Journal Of Advance Research And Innovative Ideas In Education, 3(3), pp. 2413-2418IJARIIE [Online]. Available at: http://ijariie.com/AdminUploadPdf/Review_on_Thermal_Performance_Analysis__Experimental_Study_of_Heat_Sink_used_for_Electronics_Application_ijariie5449.pdf (Accessed : 22 September 2022)
IEEE Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh, "Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application," International Journal Of Advance Research And Innovative Ideas In Education, vol. 3, no. 3, pp. 2413-2418, May-Jun 2017. [Online]. Available: http://ijariie.com/AdminUploadPdf/Review_on_Thermal_Performance_Analysis__Experimental_Study_of_Heat_Sink_used_for_Electronics_Application_ijariie5449.pdf [Accessed : 22 September 2022].
Turabian Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh. "Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application." International Journal Of Advance Research And Innovative Ideas In Education [Online]. volume 3 number 3 (22 September 2022).
Vancouver Mahendra Sukhadeo Walunjkar, and Prof. Dipak A Deshmukh. Review on Thermal Performance Analysis &Experimental Study of Heat Sink used for Electronics Application. International Journal Of Advance Research And Innovative Ideas In Education [Internet]. 2017 [Cited : 22 September 2022]; 3(3) : 2413-2418. Available from: http://ijariie.com/AdminUploadPdf/Review_on_Thermal_Performance_Analysis__Experimental_Study_of_Heat_Sink_used_for_Electronics_Application_ijariie5449.pdf
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